Polishing apparatus and method for detecting foreign matter on polishing surface
A Standard patent application filed on 27 February 2003 credited to Togawa, Tetsuji ; Nabeya, Osamu

Details

Application number :

2003209718  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polishing apparatus and method for detecting foreign matter on polishing surface  

Inventor :

Togawa, Tetsuji ; Nabeya, Osamu  

Agent name :

 

Address for service :

 

Filing date :

27 February 2003  

Associated companies :

 

Applicant name :

EBARA CORPORATION  

Applicant address :

11-1, Haneda Asahi-cho, Ohta-ku, Tokyo 144-8510  

Old name :

 

Original Source :

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Same Inventor

• Substrate holding device and polishing device
• Polishing method