Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation
A Standard patent application filed on 17 January 2003 credited to Leap, Gerald

Details

Application number :
2003203040  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation  
Inventor :
Leap, Gerald  
Agent name :
 
Address for service :
 
Filing date :
17 January 2003  
Associated companies :
 
Applicant name :
SPEEDLINE TECHNOLOGIES, INC.  
Applicant address :
16 Forge Park, Franklin, MA 02038  
Old name :
 
Original Source :
Go  

Same Inventor