Connection package for high-speed integrated circuit
A Standard patent application filed on 21 November 2002 credited to Lao, Binneg Y. ; Chen, William W. ; Kim, Inho ; Rowe, David A.

Details

Application number :
2002365569  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Connection package for high-speed integrated circuit  
Inventor :
Lao, Binneg Y. ; Chen, William W. ; Kim, Inho ; Rowe, David A.  
Agent name :
 
Address for service :
 
Filing date :
21 November 2002  
Associated companies :
 
Applicant name :
SIERRA MONOLITHICS, INC.  
Applicant address :
103 West Torrance Boulevard, Redondo Beach, CA 90277  
Old name :
 
Original Source :
Go  

Same Inventor