Surface mounted package with die bottom spaced from support board
A Standard patent application filed on 23 December 2002 credited to Standing, Martin ; Sawle, Andrew N.

Details

Application number :

2002361873  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Surface mounted package with die bottom spaced from support board  

Inventor :

Standing, Martin ; Sawle, Andrew N.  

Agent name :

 

Address for service :

 

Filing date :

23 December 2002  

Associated companies :

 

Applicant name :

INTERNATIONAL RECTIFIER CORPORATION  

Applicant address :

233 Kansas Street, El Segundo, CA 90245  

Old name :

 

Original Source :

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