Methods for fabricating interconnect structures having low k dielectric properties
A Standard patent application filed on 26 December 2002 credited to Romm, Leonid ; Gotkis, Yehiel ; Lin, Te Hua ; Kistler, Rodney

Details

Application number :

2002360756  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Methods for fabricating interconnect structures having low k dielectric properties  

Inventor :

Romm, Leonid ; Gotkis, Yehiel ; Lin, Te Hua ; Kistler, Rodney  

Agent name :

 

Address for service :

 

Filing date :

26 December 2002  

Associated companies :

 

Applicant name :

LAM RESEARCH CORPORATION  

Applicant address :

4650 Cushing Parkway, Fremont, CA 94538  

Old name :

 

Original Source :

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