High capacity memory module with built-in performance enhancing features
A Standard patent application filed on 22 November 2002 credited to Li, Che-Yu ; Fan, Zhineng ; Moriarty, Sharon L. ; Brown, Dirk D.

Details

Application number :

2002359532  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High capacity memory module with built-in performance enhancing features  

Inventor :

Li, Che-Yu ; Fan, Zhineng ; Moriarty, Sharon L. ; Brown, Dirk D.  

Agent name :

 

Address for service :

 

Filing date :

22 November 2002  

Associated companies :

 

Applicant name :

HIGH CONNECTION DENSITY, INC.  

Applicant address :

1267 Borregas Avenue, Sunnyvale, CA 94089-1303  

Old name :

 

Original Source :

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