Device and method for filling and packaging, packaged body, and method of manufacturing the packaged body
A Standard patent application filed on 25 December 2002 credited to Midorikawa, Kouji
Details
Application number :
2002357513
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Device and method for filling and packaging, packaged body, and method of manufacturing the packaged body
Inventor :
Midorikawa, Kouji
Agent name :
Address for service :
Filing date :
25 December 2002
Associated companies :
Applicant name :
KUREHA CHEMICAL INDUSTRY CO., LTD.
Applicant address :
1-9-11, Nihonbashi Horidome-cho, Chuo-ku, Tokyo 103-8552