Polymerizable compound, polymerizable composition and cured product containing the compound
A Standard patent application filed on 25 July 2002 credited to Uchida, Hiroshi ; Kai, Kazufumi ; Honda, Yoshihiro ; Ohta, Keisuke ; Ooga, Kazuhiko

Details

Application number :

2002355225  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polymerizable compound, polymerizable composition and cured product containing the compound  

Inventor :

Uchida, Hiroshi ; Kai, Kazufumi ; Honda, Yoshihiro ; Ohta, Keisuke ; Ooga, Kazuhiko  

Agent name :

 

Address for service :

 

Filing date :

25 July 2002  

Associated companies :

 

Applicant name :

SHOWA DENKO K. K.  

Applicant address :

13-9, Shiba Daimon 1-chome, Minato-ku, Tokyo 105-8518  

Old name :

 

Original Source :

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