Thermal enhanced extended surface tape for integrated circuit heat dissipation

Application number :: 2002345617
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Thermal enhanced extended surface tape for integrated circuit heat dissipation
Inventor :: Long, David C. ; Scanzano, Francis X. ; Corti, William D. ; Won, Michael ; Yuan, Tsorng-Dih ; Marsh, Joseph O.
Agent name :
Address for service :
Filing date :: 07 June 2002
Associated companies :
Applicant name :: INTERNATIONAL BUSINESS MACHINES CORPORATION
Applicant address :: New Orchard Road, Armonk, NY 10504
Old name :
Original Source :: Go

Thermal enhanced extended surface tape for integrated circuit heat dissipation A Standard patent application filed on 07 June 2002 credited to Long, David C. ; Scanzano, Francis X. ; Corti, William D. ; Won, Michael ; Yuan, Tsorng-Dih ; Marsh, Joseph O.