Surface mount attachable land grid array connector and method of forming same
A Standard patent application filed on 13 September 2002 credited to Le, Ai D. ; Li, Che-Yu ; Fan, Zhineng ; Chiang, Shinwu ; Ali, Hassan O.

Details

Application number :

2002339931  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Surface mount attachable land grid array connector and method of forming same  

Inventor :

Le, Ai D. ; Li, Che-Yu ; Fan, Zhineng ; Chiang, Shinwu ; Ali, Hassan O.  

Agent name :

 

Address for service :

 

Filing date :

13 September 2002  

Associated companies :

 

Applicant name :

HIGH CONNECTION DENSITY, INC.  

Applicant address :

1267 Borregas Avenue, Sunnyvale, CA 94089-1308  

Old name :

 

Original Source :

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