Semiconductor package device and method of formation and testing
A Standard patent application filed on 16 October 2002 credited to Gerber, Mark A. ; Thompson, Trent A. ; O'Connor, Shawn M.

Details

Application number :

2002337875  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor package device and method of formation and testing  

Inventor :

Gerber, Mark A. ; Thompson, Trent A. ; O'Connor, Shawn M.  

Agent name :

 

Address for service :

 

Filing date :

16 October 2002  

Associated companies :

 

Applicant name :

MOTOROLA, INC.  

Applicant address :

1303 East Algonquin Road, Schaumburg, IL 60196  

Old name :

 

Original Source :

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