Slurry composition for use in chemical mechanical polishing of metal wiring
A Standard patent application filed on 06 August 2002 credited to Yoon, Bo Un ; Hong, Chang Ki ; Roh, Hyun Soo ; Do, Won Joong ; Lee, Jong Won ; Lee, Kil Sung ; Hah, Sang Rok ; Lee, Jae Seok

Details

Application number :

2002321915  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Slurry composition for use in chemical mechanical polishing of metal wiring  

Inventor :

Yoon, Bo Un ; Hong, Chang Ki ; Roh, Hyun Soo ; Do, Won Joong ; Lee, Jong Won ; Lee, Kil Sung ; Hah, Sang Rok ; Lee, Jae Seok  

Agent name :

 

Address for service :

 

Filing date :

06 August 2002  

Associated companies :

 

Applicant name :

CHEIL INDUSTRIES INC.  

Applicant address :

290, Kongdan-Dong, 730-030 Kumi-Shi  

Old name :

 

Original Source :

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