Extension of fatigue life for c4 solder ball in a chip to substrate connection
A Standard patent application filed on 04 June 2002 credited to Carey, Charles E. ; Gramatzki, Eberhard B. ; Johnson, Eric A. ; Memis, Irving ; Bernier, William E. ; White, Robert F. ; Tran, Son K. ; Homa, Thomas R. ; Langevin, Pierre

Details

Application number :

2002321103  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Extension of fatigue life for c4 solder ball in a chip to substrate connection  

Inventor :

Carey, Charles E. ; Gramatzki, Eberhard B. ; Johnson, Eric A. ; Memis, Irving ; Bernier, William E. ; White, Robert F. ; Tran, Son K. ; Homa, Thomas R. ; Langevin, Pierre  

Agent name :

 

Address for service :

 

Filing date :

04 June 2002  

Associated companies :

 

Applicant name :

INTERNATIONAL BUSINESS MACHINES CORPORATION  

Applicant address :

New Orchard Road, Armonk, NJ 10504  

Old name :

 

Original Source :

Go