Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor
A Standard patent application filed on 12 July 2002 credited to Kamoto, Daigoro ; Yamamoto, Hiroki ; Takahashi, Ken ; Shiono, Osamu ; Motowaki, Shigehisa ; Suzuki, Yasutaka ; Ishikawa, Takao ; Miwa, Takao ; Naito, Takashi ; Namekawa, Takashi ; Sato, Toshiya ;

Details

Application number :

2002318729  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor  

Inventor :

Kamoto, Daigoro ; Yamamoto, Hiroki ; Takahashi, Ken ; Shiono, Osamu ; Motowaki, Shigehisa ; Suzuki, Yasutaka ; Ishikawa, Takao ; Miwa, Takao ; Naito, Takashi ; Namekawa, Takashi ; Sato, Toshiya ;  

Agent name :

 

Address for service :

 

Filing date :

12 July 2002  

Associated companies :

 

Applicant name :

HITACHI, LTD.  

Applicant address :

6, Kanda Surugadai 4-chome, Chiyoda-ku, Tokyo 101-8010  

Old name :

 

Original Source :

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