Configurable plasma volume etch chamber
A Standard patent application filed on 21 June 2002 credited to Yen, Bi-Ming ; Ni, Tuqiang ; Li, Lumin ; Hemker, David

Details

Application number :

2002316325  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Configurable plasma volume etch chamber  

Inventor :

Yen, Bi-Ming ; Ni, Tuqiang ; Li, Lumin ; Hemker, David  

Agent name :

 

Address for service :

 

Filing date :

21 June 2002  

Associated companies :

 

Applicant name :

LAM RESEARCH CORPORATION  

Applicant address :

4650 Cushing Parkway, Fremont, CA 94538  

Old name :

 

Original Source :

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