Dual damascene multi-level metallization
A Standard patent application filed on 14 May 2002 credited to Correale, Anthony Jr. ; Agarwala, Birendra N. ; Sullivan, Timothy D. ; Rathore, Hazara S. ; Coker, Eric M.

Details

Application number :

2002314065  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Dual damascene multi-level metallization  

Inventor :

Correale, Anthony Jr. ; Agarwala, Birendra N. ; Sullivan, Timothy D. ; Rathore, Hazara S. ; Coker, Eric M.  

Agent name :

 

Address for service :

 

Filing date :

14 May 2002  

Associated companies :

 

Applicant name :

INTERNATIONAL BUSINESS MACHINES CORPORATION  

Applicant address :

New Orchard Road, Armonk, NY 10504  

Old name :

 

Original Source :

Go