Structure and method of fabricating embedded vertical dram arrays with silicided bitline and polysilicon interconnect
A Standard patent application filed on 27 June 2002 credited to Radens, Carl ; Mandelman, Jack ; Gruening, Ulrike ; Divakaruni, Ramachandra ; Nesbit, Larry

Details

Application number :

2002310537  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Structure and method of fabricating embedded vertical dram arrays with silicided bitline and polysilicon interconnect  

Inventor :

Radens, Carl ; Mandelman, Jack ; Gruening, Ulrike ; Divakaruni, Ramachandra ; Nesbit, Larry  

Agent name :

 

Address for service :

 

Filing date :

27 June 2002  

Associated companies :

 

Applicant name :

INTERNATIONAL BUSINESS MACHINES CORPORATION  

Applicant address :

New Orchard Road, Armonk, NY 10504  

Old name :

 

Original Source :

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