A method of forming flexible insulation protection film of flexible circuit board and flexible circuit board formed with flexible insulation protection film and production method therefor
A Standard patent application filed on 03 June 2002 credited to Sagawa, Kouichirou ; Orikabe, Hiroshi

Details

Application number :

2002304150  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A method of forming flexible insulation protection film of flexible circuit board and flexible circuit board formed with flexible insulation protection film and production method therefor  

Inventor :

Sagawa, Kouichirou ; Orikabe, Hiroshi  

Agent name :

 

Address for service :

 

Filing date :

03 June 2002  

Associated companies :

 

Applicant name :

AJINOMOTO CO., INC.  

Applicant address :

15-1, Kyobashi 1-chome, Chuo-ku, Tokyo 104-8315  

Old name :

 

Original Source :

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