Semiconductor package with internal heat spreader
A Standard patent application filed on 19 December 2001 credited to Garner, Scott D. ; Zuo, Jon

Details

Application number :

2002239661  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor package with internal heat spreader  

Inventor :

Garner, Scott D. ; Zuo, Jon  

Agent name :

 

Address for service :

 

Filing date :

19 December 2001  

Associated companies :

 

Applicant name :

THERMAL CORP.  

Applicant address :

RT. 113 AND Edward Street, P.O. Box 477, Georgetown, DE 19947  

Old name :

 

Original Source :

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