Hot melt processable pressure sensitive adhesive comprising organophilic clay plate-like particles, a method of making, and articles made therefrom
A Standard patent application filed on 22 January 2002 credited to Peterson, James R.
;
Zhou, Zhiming
;
Ma, Jingjing
Details
Application number :
2002235506
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Hot melt processable pressure sensitive adhesive comprising organophilic clay plate-like particles, a method of making, and articles made therefrom
Inventor :
Peterson, James R.
;
Zhou, Zhiming
;
Ma, Jingjing
Agent name :
Address for service :
Filing date :
22 January 2002
Associated companies :
Applicant name :
3M INNOVATIVE PROPERTIES COMPANY
Applicant address :
3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427