Method of forming conductive interconnections wherein a barrier layer is removed by an etching process
A Standard patent application filed on 26 July 2001 credited to Ryan, Errol Todd ; Mauersberger, Frank ; Hause, Frederick N. ; Brennan, William S. ; Besser, Paul R. ; Beckage, Peter J. ; Iacoponi, John A.

Details

Application number :

2001279032  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of forming conductive interconnections wherein a barrier layer is removed by an etching process  

Inventor :

Ryan, Errol Todd ; Mauersberger, Frank ; Hause, Frederick N. ; Brennan, William S. ; Besser, Paul R. ; Beckage, Peter J. ; Iacoponi, John A.  

Agent name :

 

Address for service :

 

Filing date :

26 July 2001  

Associated companies :

 

Applicant name :

Advanced Micro Devices Inc.  

Applicant address :

 

Old name :

 

Original Source :

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