Method of producing semiconductor integrated circuit device and method of producing multi-chip module
A Standard patent application filed on 15 August 2001 credited to Mori, Kazutaka ; Miyazaki, Ko ; Terasawa, Tsuneo ; Tanaka, Toshihiko ; Hasegawa, Norio

Details

Application number :

2001278736  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of producing semiconductor integrated circuit device and method of producing multi-chip module  

Inventor :

Mori, Kazutaka ; Miyazaki, Ko ; Terasawa, Tsuneo ; Tanaka, Toshihiko ; Hasegawa, Norio  

Agent name :

 

Address for service :

 

Filing date :

15 August 2001  

Associated companies :

 

Applicant name :

Hitachi Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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