Spunbonded heat seal material
A Standard patent application filed on 12 June 2001 credited to Viazmensky, Helen
;
Giovannoni, Richard T.
;
Allen, John M.
Details
Application number :
2001275521
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Spunbonded heat seal material
Inventor :
Viazmensky, Helen
;
Giovannoni, Richard T.
;
Allen, John M.
Agent name :
Pizzeys Patent and Trade Mark Attorneys
Address for service :
Level 20 324 Queen Street Brisbane QLD 4000 Australia
Filing date :
12 June 2001
Associated companies :
Applicant name :
Ahlstrom Windsor Locks LLC
Applicant address :
Two Elm Street Windsor Locks CT 06096 United States of America