Electronic package having embedded capacitors and method of fabrication therefor
A Standard patent application filed on 14 June 2001 credited to Hale, Aaron ; Figueroa, David ; Kohmura, Toshimi ; Walk, Michael ; Vrtis, Joan

Details

Application number :

2001266944  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Electronic package having embedded capacitors and method of fabrication therefor  

Inventor :

Hale, Aaron ; Figueroa, David ; Kohmura, Toshimi ; Walk, Michael ; Vrtis, Joan  

Agent name :

 

Address for service :

 

Filing date :

14 June 2001  

Associated companies :

 

Applicant name :

Intel Corporation  

Applicant address :

 

Old name :

 

Original Source :

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