Method of bonding permeable substrates with hot melt moisture cure adhesive having low viscosity and high green strength
A Standard patent application filed on 06 June 2001 credited to Kryzer, Brendon J. ; Bunnelle, William L. ; Zimmel, John M.

Details

Application number :

2001266735  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of bonding permeable substrates with hot melt moisture cure adhesive having low viscosity and high green strength  

Inventor :

Kryzer, Brendon J. ; Bunnelle, William L. ; Zimmel, John M.  

Agent name :

 

Address for service :

 

Filing date :

06 June 2001  

Associated companies :

 

Applicant name :

H.B. Fuller Licensing and Financing Inc.  

Applicant address :

 

Old name :

 

Original Source :

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